NPI WB Engineer

Full time @STMICROELECTRONICS SDN BHD in Engineering / Robotics / Automation
  • Johor, Malaysia, Tanjung Agas, Muar town, Johor 84000, Malaysia View on Map
  • Apply Before : March 31, 2023
  • Salary: RM3,500.00 - RM7,000.00 / Monthly
  • 0 Application(s)

Job Detail

  • Career Level Senior
  • Experience 3 Years
  • Qualifications Bachelor Degree

Job Description


  • To develop & to industrialize new wire bond process (Copper, Gold and Silver Wire) for new packages / products (QFP, PSSO, PSO, HiQuad, SO, BGA, SSOP)
  • To support qualification lot and engineering lot to meet time-to market for new packages / new products.
  • To drive Gold Saving Program for cost reduction projects
  • To drive Long Life Capillary qualifications.
  • To support wire bond process optimization during major quality complaint.
  • To characterize new wire bond direct and indirect materials
  • To develop robust looping profile for new products.


  • Bachelor’s degree in mechanical engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
  • Minimum 1-2 years of working experience in Gold/Copper/Silver ball bonding process.
  • Able to handle wire bonder machine such as ASM Express/Aero or KNS Iconn+/Rapid or equivalent model.
  • Skill in Design of Experiment. Skill in SAS-JMP will be an added advantage.
  • Skill in analytical trouble shooting.
  • Know FMEA, 8D and other QA tools.
  • Good inter-personal skills and able to work well under pressure.