
NPI WB Engineer
Full time @STMICROELECTRONICS SDN BHD in Engineering / Robotics / Automation ShortlistJob Detail
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Career Level Senior
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Experience 3 Years
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Qualifications Bachelor Degree
Job Description
Responsibilities:
- To develop & to industrialize new wire bond process (Copper, Gold and Silver Wire) for new packages / products (QFP, PSSO, PSO, HiQuad, SO, BGA, SSOP)
- To support qualification lot and engineering lot to meet time-to market for new packages / new products.
- To drive Gold Saving Program for cost reduction projects
- To drive Long Life Capillary qualifications.
- To support wire bond process optimization during major quality complaint.
- To characterize new wire bond direct and indirect materials
- To develop robust looping profile for new products.
Requirements:
- Bachelor’s degree in mechanical engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
- Minimum 1-2 years of working experience in Gold/Copper/Silver ball bonding process.
- Able to handle wire bonder machine such as ASM Express/Aero or KNS Iconn+/Rapid or equivalent model.
- Skill in Design of Experiment. Skill in SAS-JMP will be an added advantage.
- Skill in analytical trouble shooting.
- Know FMEA, 8D and other QA tools.
- Good inter-personal skills and able to work well under pressure.