[FRESH GRAD ONLY – SEPT 2026 INTAKE] Engineer, Technology Development Engineering

Sandisk Storage Malaysia in Engineering / Robotics / Automation

Job Description

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Perform package and device analysis on assembly test defect from production and qualification on semi-finished or finished products.
  • Define the Failure Analysis flow for each case.
  • Generate Failure Analysis report and assist teams for root-causing of defect/s.
  • Maintain lab in quality system compliance.

Qualifications

REQUIRED:

  • Master’s / Bachelor’s Degree in Electrical & Electronic or Material Engineering

PREFERRED:

  • Familiar with package and device analysis methodology
  • Familiar with memory product technology and structure
  • Understand memory product test process and methodology
  • Strong memory IC de-processing skills.
  • Good communication, presentation skills and teamwork spirit.
  • Fluent in English speaking, reading and technical FA report writing
 
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