Plating Process Development Engineer

Full time @STMICROELECTRONICS SDN BHD in Engineering / Robotics / Automation
  • Johor, Malaysia, Tanjung Agas, Muar town, Johor 84000, Malaysia View on Map
  • Apply Before : December 31, 2022
  • Salary: RM3,200.00 - RM7,000.00 / Monthly
  • 0 Application(s)

Job Detail

  • Career Level Senior
  • Experience 2 Years
  • Qualifications Bachelor Degree

Job Description

Responsibilities:

  • To setup plating (Cu/Tin) process.
  • To develop and to industrialize Cu plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application.
  • To support assembly of engineering sample for new packages or new technologies.
  • To characterize assemble plating process and materials.
  • To generate and update process specifications, SOP, FMEA and process control plan.
  • To provide technical support when there are critical quality concerns related to assembly EOL material / process.

Requirements:

  • More than 3 years working experience.
  • Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
  • Equipped with statistical data analysis, analytical and problem-solving skills especially at plating process.
  • Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc.
  • Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.
  • Practice high performance behavior and together work as Team in executing projects & strive for excellent.

Required skills