Assembly Process Development Engineer – ABF Lamination/Via formation
Full time @STMICROELECTRONICS SDN BHD in Engineering / Robotics / Automation ShortlistJob Detail
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Career Level Senior
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Experience 3 Years
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Qualifications Bachelor Degree
Job Description
Responsibilities:
- To setup laminate, expose, develop, strip and etching process.
- To develop and to industrialize laminate, expose, develop, strip and etching process for new packages, introduce materials to meet the quality, yield, and mission of new application.
- To support assembly of engineering sample for new packages or new technologies.
- To characterize assemble plating process and materials.
- To generate and update process specifications, SOP, FMEA and process control plan.
- To provide technical support when there are critical quality concerns related to assembly EOL material / process.
Requirements:
- More than 3 years working experience.
- Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
- Equipped with statistical data analysis, analytical and problem-solving skills especially at plating process.
- Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc.
- Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.
- Practice high performance behavior and together work as Team in executing projects & strive for excellent.